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AMD Zen 5 rumours

CAT-THE-FIFTH said:
Intel does have access to more advanced packaging technologies than AMD which is helpful.
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Yes, Intel's foundry may have become a joke but they have invested very heavily in packaging. Well suited to mix and match of internal and external foundries?

And it is far more advanced than what AMD use (well in the consumer space - MI300 is a no packaging expense spared type thing).

Still I feel it is my duty for the next few years to often repeat the words glue, superglue in relation to Intel's products because Intel PR dug themselves into that corner!
 
KompuKare said:
Yes, Intel's foundry may have become a joke but they have invested very heavily in packaging. Well suited to mix and match of internal and external foundries?

And it is far more advanced than what AMD use (well in the consumer space - MI300 is a no packaging expense spared type thing).

Still I feel it is my duty for the next few years to often repeat the words glue, superglue in relation to Intel's products because Intel PR dug themselves into that corner!
Click to expand...

AMD=Glue.
Intel=Super Glue.
 
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