since you cant be bothered, heres a shorter one:
Simply put: it’s just not worth making denser chips, and it’s getting increasingly difficult to do so. The steps required to manufacture chips have increased in quantity and complexity due to how gigantic the wavelengths of light are in comparison to the transistors they are outlining. Taking 193nm wavelengths down to 7nm requires a lot of clever trickery to work – GloFo CTO, Gary Patton, even went as far to call 7nm immersion lithography an “extreme sport” in an interview with
IEEE Spectrum.
In turn, this increases time and money spent on every single product leaving a fab. Not only that, but the more complex a manufacturing process, the higher chance there is of something going wrong, and subsequently, the lower a fab’s yields will be. As you can imagine, that’s not too great when you plan on mass producing an entire CPU architecture for the immensely large computing market, and without angering shareholders.
you are both missing the important part of making the cips out which is why you both seem to be under the impression its cheaper and easier.